• Date of Foundation: 2019
  • Country: China
  • Revenue:
  • CEO: Gavin Liang
  • Products: Power Semiconductors, SiC Power Modules
  • Website: www.leapers-power.com

Company Overview

Leapers Semiconductor is an innovative developer and manufacturer of power semiconductors, SiC and IGBT modules for power electronics applications. Founded in 2019, Leapers Semiconductors is headquartered in Wuxi, China, and has R&D center in Japan.

Leapers Semiconductor is comprised of experienced professionals with deep knowledge of wafer process, semiconductors design and packaging, quality control, product application, supply chain, customer support, sales, and marketing.

Company’s dedication to every detail lets the company provide their partners with highly reliable silicon carbide (SiC) modules and IGBT modules for various applications like new energy vehicles, smart grid, solar and wind power generation, motor drives, medical equipment, uninterruptible power supplies, traction, etc.

History and Major Milestones

Leapers Semiconductor was founded in 2019. The company has manufacturing facilities in China and Japan. It is headquartered in Wuxi, China.

Leapers Semiconductor main focus is silicon carbide power devices. The company uses the latest generation chips to develop best in class SiC MOSFET power modules.

By using innovative advanced packaging material and processing technology, Leapers Semiconductor provides comprehensive module application solutions for miniaturization, efficiency and light weighting of electrical drive systems and inverters of new energy vehicles.

To deliver best in class SiC power modules in 2021 Leapers Semiconductor introduced its patented Arcbonding™ technology.

Leapers Semiconductor Product Portfolio

Unlike traditional Al wire bonding technology used by many manufacturers of automotive grade power semiconductors, Arcbonding™ patented chip surface connecting technology ensures the reliability of SiC modules reach automotive application requirements. Besides it helps to significantly reduce parasitic resistance and parasitic inductance. Besides, Arcbonding™ proved to significantly reduce static losses, improve power cycling, and the ability of short time impulse current.

In 2022 the company introduced the automotive grade HPD SiC power modules. HPD series are 1200 V three-phase water-cooled SiC MOSFET power modules in industry recognized automotive footprint, which are optimized for traction inverters and motor drives. HPD series provide high power density and efficiency for inverters designed for longer driving range and lower battery cost.

In HPD series Leapers Semiconductor uses silver sintering for die attach, high grade Si3N4 AMB substrates for higher thermal performance and robustness, and highly reliable epoxy resin potting technology.


Leapers Semiconductor divides their products in the following categories:

  • SiC MOSFET Power Modules
  • IGBT Modules

SiC MOSFET Power Modules product portfolio includes power semiconductor devices in the following industrial footprints:

  • ED3
  • HPD
  • F0
  • E0
  • E2
  • ED3S

Through its technological innovations Leapers Semiconductor aims to move humanity forward to the better and greener future. Its product portfolio responds to all global challenges, especially to the world carbon neutrality.